Term of warranty
Q&A
Features:
Design For EVGA X58 SLI(E758) And X58 FTW3(E768) M/B-MOS Part #1.
Stand-Off II Design
Full Contact On All MOS Area Heat Components.
Top Cover Made Of CNC Machined POM.
Block Base Made Of C1100.
Copper Base High Durability Nickel Finished In Shining Black.
RoHS Compliant.
Dimension ( LxWxH ) : 127.41x30.75x28.6 MM (Out-Line)
Thread : G1/4" x 2
Included :
Fujipoly Thermal PAD Included.
Backup O-Ring For EI58DP V2 x 1PCS
Mounting Screws/Accessories -Hard Mount Available Now Only.
Q&A
Features:
Design For EVGA X58 SLI(E758) And X58 FTW3(E768) M/B-MOS Part #1.
Stand-Off II Design
Full Contact On All MOS Area Heat Components.
Top Cover Made Of CNC Machined POM.
Block Base Made Of C1100.
Copper Base High Durability Nickel Finished In Shining Black.
RoHS Compliant.
Dimension ( LxWxH ) : 127.41x30.75x28.6 MM (Out-Line)
Thread : G1/4" x 2
Included :
Fujipoly Thermal PAD Included.
Backup O-Ring For EI58DP V2 x 1PCS
Mounting Screws/Accessories -Hard Mount Available Now Only.
*** Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. ***
*** From 15th March 2018, all of our installation guides will be provided electronically via an easy-to-use QR code attached to the packaging. ***
*** Before filling in the water, please make sure all the components are installed correctly. To prevent any leakage which may damage the PC components, please perform a 24-hour leaking test with only the pump connected to the power supply. ***
Last updated :
Bitspower MOS EI58DP V2 POM Version
- Product Code: BP-WBPEI58DPV2-BK
- Availability: EOL
- UPC:
- EAN: